Hypertec 67Y1432-HY (Legacy) memory module 2 GB 1 x 2 GB DDR3 1333 MHz ECC DDR4 2 V Memory ranking 1

2 V Memory ranking 1 ECC No Memory clock speed 2666 MHz Internal memory type DDR4 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for Laptop Memory form factor 260-pin SO-DIMM CAS latency 19 Memory voltage 1

there may be occasions where we need to utilise professionally repurposed components

Memory Buffered memory type Registered (buffered) Internal memory 16 GB Memory form factor 240-pin DIMM Memory ranking 2 Internal memory type DDR3 Features Buffered memory type Registered (buffered) Internal memory 16 GB Memory form factor 240-pin DIMM Memory ranking 2 Internal memory type DDR3

35 V Memory channels Single-channel ECC Yes Memory clock speed 1600 MHz Internal memory type DDR3L Features Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for PC/server Memory form factor 240-pin DIMM CAS latency 11 Memory voltage 1

Memory Package type DIMM Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Component for PC/server Memory form factor 240-pin DIMM Memory type PC3-10600 Memory clock speed 1333 MHz Internal memory type DDR3 Technical details Number of pins 240 Features Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Component for PC/server Memory form factor 240-pin DIMM Memory type PC3-10600 Memory clock speed 1333 MHz Internal memory type DDR3 Weight & dimensions Package type DIMM Packaging data Package type DIMM Other features Number of pins 240

Hypertec 67Y1432-HY (Legacy) memory module 2 GB 1 x 2 GB DDR3 1333 MHz ECC DDR4 2 V Memory ranking 1A Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to